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片式多层电容电阻复合元件的研制
引用本文:周少荣,陈世忠,陈锦清. 片式多层电容电阻复合元件的研制[J]. 电子元件与材料, 2002, 21(6): 6-7,19
作者姓名:周少荣  陈世忠  陈锦清
作者单位:广东风华高新科技集团有限公司,广东,肇庆,526020
摘    要:采用低温共烧陶瓷(LTCC)技术将电容、电阻元件集成在多层陶瓷基板里,构成了一种新型的片式多层复合元件,并研究了其制造工艺性能和频率特性。结果表明,片式多层电容电阻复合元件制造工艺适合批量化生产,并为片式多层LC滤波器、LTCC基板及器件的研发提供了极好的参考价值。

关 键 词:多层陶瓷结构  低温共烧陶瓷  复合元件
文章编号:1001-2028(2002)06-0006-02

A Chip Multilayer RC Complex Component
ZHOU Shao-rong,CHEN Shi-zhong,CHEN Jin-qing. A Chip Multilayer RC Complex Component[J]. Electronic Components & Materials, 2002, 21(6): 6-7,19
Authors:ZHOU Shao-rong  CHEN Shi-zhong  CHEN Jin-qing
Abstract:Resistors and capacitors were integrated into multilayer ceramic board by LTCC technology based on the structure of multilayer ceramic capacitor. This complex component functions as network of series resistor-capacitor. The multilayer structure consists of very thin dielectric layers of wollastonite glass-ceramics, silver capacitor electrodes, and resistor electrodes of buried RuO2-based composition. The green multilayer body was sintered at 900℃ or less. The sintered multilayer body was coated with silver paste as its external electrode. The technology for processing the complex component and the frequency properties were investigated. It is found that the impedence of complex component dropped down to a constant value as test frequence was increasing. The processing technology is suitable mass production.
Keywords:multilayer ceramic structure  low temperature co-fired ceramics  complex component
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