Evaluating and Proposing Models of Predicting IC Debonding Failure

Debonding failure due to intermediate crack-induced (IC) fracture is one of the most dominant failure modes associated with the fiber-reinforced polymer (FRP) bonding technique. To date, extensive efforts have been paid by many researchers worldwide to study the debonding phenomenon for effective applications of FRP composites and rational design of FRP-strengthened structures. Based on these efforts and various relevant field applications, different models and code provisions have been proposed to predict IC debonding failure. Out of all the existing code provisions and models, five typical ones are investigated in the current paper. A comprehensive comparison among these code provisions and models is carried out in order to evaluate their performance and accuracy. Test results of 200 flexural specimens with IC debonding failures collected from the existing literature are used in the current comparison. The effectiveness and accuracy of each model have been evaluated based on these experimental results. Finally, based on a statistical analysis, a simple and more effective model for predicting the load-carrying capacity of FRP-strengthened flexural members due to IC debonding failure is proposed.