Over-plating工艺过程的变网格数值模拟

考察了over-plating工艺中不同线距、线宽条件下的电沉积规律。利用数值模拟方法对图形结构轮廓和电沉积速度之间的相互影响进行了分析,同时采用变网格方法来适应电沉积过程中结构轮廓的不断变化。数值模拟结果表明:当线距/线宽较大(>12)时,相邻图形的电沉积速度受到的影响很小,图形的横向和纵向的电沉积速度逐渐趋于一致;而当线距/线宽较小(<6)时,相邻电沉积图形之间相互影响显著,线距/线宽越小,纵向电沉积速度和横向电沉积速度之比越大,因此相邻电沉积图形中间区域可能产生空洞,从而出现电镀缺陷的情形。对于上述工艺缺陷,可以通过增加辅助导电层进行消除,实验结果表明效果良好。

Numerical simulations on over-plating by deformed meshes

The electrical deposition in an over-plating technology was explored under different line spaces and line widths and the effect of geometries,such as a line space/line width ratio,and the deposition velocity during the over-plating was investigated by using numerical simulations. Then,the deformed meshes were also applied to suit to the boundary grows of plated microstructure with the deposition. The numerical results indicate that the difference of deposition velocity between the two adjoined plating lines...