Effect of polymerization protocol on the degree of conversion of photo- and dual-polymerized self-etch adhesives

This study investigated the effect of different polymerization protocols on the degree of conversion (DC%) of various photo-polymerized and dual-polymerized self-etch adhesive resins. Five different photo-polymerized (All-Bond Universal, Bisco; G-ænial Bond, GC; Futurabond M+ LC, VOCO; Single Bond Universal LC, 3M ESPE and Peak Universal Bond, Ultradent) and four dual-polymerized self-etch adhesives (Futurabond U, VOCO; Gradia Core SE, GC; Futurabond M+ DC, VOCO and Single Bond Universal DC, 3 M ESPE) were tested. All adhesives were applied on potassium bromide pellets (KBr) following the manufacturer’s instructions. The KBr pellets were divided into 10 experimental groups for the photo-polymerized adhesives and 12 experimental groups for the dual-polymerized adhesives according to the two levels of the study, Level 1: polymerization protocol and Level 2: adhesive system. For the photo-polymerized adhesives, the adhesives were polymerized either at 1 or 10 mm from the KBr pellets. For the photo-polymerized adhesives, the adhesives were photo-polymerized either at 1 or 10 mm distance or polymerized chemically. The DC% of the unpolymerized and polymerized adhesives was assessed using Fourier transform infrared spectroscopy. Data were analyzed using two-way ANOVA to evaluate the effect of polymerization protocol, adhesive system, and their interaction on the DC% of the self-etch adhesives. For the photo-polymerized and dual-polymerized adhesives, one-way ANOVA and Tukey HSD post hoc test was used to evaluate the effect of adhesive system within each polymerization protocol and the effect of polymerization protocol within each adhesive for the dual-polymerized adhesives (p = 0.05). Student t-test was used to compare the effect of polymerization distances within each photo-polymerized adhesive. For both photo- and dual-polymerized adhesives, the polymerization protocol and adhesive system had a significant effect on the DC (p = 0.000). The interaction between the two factors (polymerization protocol and adhesive system) revealed also a significant effect on the DC% of the different adhesives (p = 0.000). Polymerization distance of 1 mm showed significantly higher DC% compared to 10 mm distance. When the dual-polymerized adhesives were left to set chemically, they showed the lowest DC% among all polymerization protocols. DC varied depending on the chemical composition of the self-etch adhesives. The tip of the polymerization device should be positioned as close as possible to the surface to achieve higher DC% of the tested adhesives. Photo-polymerization of the dual-polymerized self-etch adhesives is a mandatory step to improve their DC.