Modeling of single-lap composite adhesive joints under mechanical and thermal loads |
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| Authors: | S Kumar S Tampi |
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| Affiliation: | 1. Institute Center for Energy (iEnergy), Department of Mechanical and Materials Engineering, Masdar Institute of Science and Technology, Abu Dhabi, UAE.;2. Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. |
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| Abstract: | Two-dimensional (plane-stress and plane-strain) theoretical models are presented for stress analysis of adhesively bonded single-lap composite joints subjected to either thermal or mechanical loading or a combination thereof. The joints consist of similar/dissimilar orthotropic or isotropic adherends and an isotropic adhesive interlayer. The governing differential equation of the problem is obtained using a variational method which minimizes the complementary strain energy in the bonded assembly. In this formulation, through-thickness variation of shear and peel stresses in the interlayer is considered. Both shear and normal traction-free boundary conditions are exactly satisfied. Peel and shear stresses obtained from plane-strain analytical models considering a homogeneous adhesive interlayer are in close agreement with those of the finite element predictions. A systematic parametric study is also conducted to identify an ideal set of geometric and material parameters for the optimal design of single-lap composite joints. |
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| Keywords: | Adhesively bonded joints thermomechanical stresses layered materials interfaces finite element analysis variational method composites |
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