硅衬底GaN基LED研究进展

由于硅具有价格低、热导率高、大直径单晶生长技术成熟等优势以及在光电集成方面的应用潜力,GaN/Si基器件成为一个研究热点.然而,GaN与Si之间的热失配容易引起薄膜开裂,这是限制LED及其它电子器件结构生长的一个关键问题.近年来,随着工艺的发展,GaN晶体质量得到大幅度的提高.同时不少研究小组成功地在Si衬底上制造出LED.介绍了GaN薄膜开裂问题及近期硅衬底GaN基LED的研究进展.

Research Progress of GaN-based LED on Silicon

GaN/Si based devices are of great interest because the silicon substrate has superior properties, such as low-cost,high thermal conductivity,potential applications in the integration of the microelectronics and opto- electronics,mature technology in growth of Si single crystal with large diameter.However,the large thermal mis- match between GaN and Si leads to the formation of cracks in the epitaxial GaN films,which is a major problem in fabricating LEDs and other structure of electronic devices.Recently,the GaN quality has improved drastically with the development of technique.Some groups have succeeded in manufacturing LED on silicon.In this paper,the crack- ing problems of GaN film and research progress of GaN-based LED on Si are outlined.