| 电子封装器件GBA的实时全息干涉实验研究 |
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| 引用本文： | 王卫宁,张存林.电子封装器件GBA的实时全息干涉实验研究[J].四川激光,1999,20(3):46-48. |
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| 作者姓名： | 王卫宁 张存林 |
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| 作者单位： | 首都师范大学物理系 |
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| 基金项目： | 中国科学院资助项目，69776029， |
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| 摘 要： | 本文采用实时全息干涉方法对电运行中的ＰＢＧＡ器件及外部热辐射条件下ＰＢＧＡ的离面变形进行了测量，得到ＰＢＧＡ呈球面弯曲及马鞍形翘曲变形的实验结果，并初步分析了产生形变差异的原因。
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| 关 键 词： | PBGA SMT 实时全息干涉 热变形 电子封装器件 |
Studies of thermal deformation in PBGA assembly using real-time holographic interferometry |
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| Wang Weining,Zhang Cunlin,Wu Yiping,Wang Zhaoyang.Studies of thermal deformation in PBGA assembly using real-time holographic interferometry[J].Laser Journal,1999,20(3):46-48. |
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| Authors: | Wang Weining Zhang Cunlin Wu Yiping Wang Zhaoyang |
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| Abstract: | In this paper,a non-destructive testing method
based on the real-time holographic interferometry (RTHI) is used to investigate the
dynamic out-of-plane deformation of a PBGA-PCB assembly.The deformation types of the
ball-shape out-of-bending and saddle-shape warpage under the conditions of the different
electronic power heating are found.In addition,the characteristics of the fringe fields of
single PBGA and PBGA in a computer mother-board are compared and the cause producing
different fringe fields is analyzed. |
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