Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering |
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| Authors: | G. Elger M. Hutter H. Oppermann R. Aschenbrenner H. Reichl E. Jäger |
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| Affiliation: | Fraunhofer-IZM, Gustav-Meyer-Allee 25, 13355 Berlin, Germany, DE
EPIGAP Optoelektronik GmbH, K?penicker Stra?e 325b, 12255 Berlin, Germany, DE
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| Abstract: | A packaging process for flip-chip LEDs (light emitting diodes) is described. The LEDs are picked and placed on a silicon substrate wafer. After reflow the substrates are individualized. AuSn solder is used for the interconnection. The solder compounds, Au and Sn, are electroplated separately: Sn on the silicon substrate and Au on the chip. The interconnections formed by tin-rich and by gold-rich intermetallic phases are compared. The metallurgy and the reliability of the LEDs are investigated. The superiority of the gold-rich interconnection is demonstrated. Received: 30 May 2001 / Accepted: 17 July 2001 |
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