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Synthesis and properties of bismaleimide resin containing dicyclopentadiene or dipentene. VI
Authors:Hann‐Jang Hwang  Chun‐Hung Li  Chun‐Shan Wang
Abstract:New aromatic bismaleimides (BMIs), bis(4‐maleimidophenoxy‐3,5‐dimethylphenyl)dicyclopentadiene (DCPDBMI) and bis(4‐maleimido‐phenoxy‐3,5‐dimethylphenyl)dipentene (DPBMI), containing a large dicyclopentadiene (DCPD) or dipentene (DP) and aryl ether linkage, were synthesized from diamine bis(4‐aminophenoxy‐3,5‐dimethylphenyl)dicyclopentadiene (DCPDA) or bis(4‐aminophenoxy‐3,5‐dimethylphenyl)dipentene(DPA) and maleic anhydride by the usual two‐step procedure that included ring‐opening addition to give bismaleamic acid, followed by cyclodehydration to bismaleimide. The monomers were characterized by Fourier transform infrared spectroscopy, proton NMR, elemental analyses, and mass spectra. Their thermal polymerization was investigated by DSC. The presence of a large cycloaliphatic moiety in the backbone of the bismaleimide increased the curing temperature and reduced the reactivity of the maleimide bond. Thermal and electrical properties of cured bismaleimide resins were studied using a dielectric analyzer, dynamic mechanical analyzer, and thermal gravimetric analyzer. These data were compared with that of commercial 4,4‐bismaleimidodiphenylmethane (DDMBMI). The cured DCPDBMI or DPBMI exhibits a lower dielectric constant, dissipation factor and moisture absorption than those of DDMBMI. Copyright © 2006 Society of Chemical Industry
Keywords:dielectric constant  high‐performance polymers  thermal properties
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