| 退火态Cu膜表面形貌的分形特征 |
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| 引用本文： | 雒向东,罗崇泰.退火态Cu膜表面形貌的分形特征[J].电子显微学报,2009,28(3):209-213. |
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| 作者姓名： | 雒向东 罗崇泰 |
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| 作者单位： | 1. 兰州城市学院培黎工程技术学院,甘肃,兰州,730070;中国空间技术研究院兰州物理研究所,甘肃,兰州,730000
2. 中国空间技术研究院兰州物理研究所,甘肃,兰州,730000 |
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| 基金项目： | 甘肃省自然科学基金项目暨中青年科技基金资助项目 |
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| 摘 要： | 用磁控溅射工艺在Si基片上沉积500nm厚Cu膜，并在不同温度下进行快速退火处理。用扫描电镜（SEM）与原子力显微镜（AFM）观察薄膜表面形貌，并根据分形理论予以定量表征。结果表明：当退火温度T在小于673K范围内增加时，分形维数Dr逐渐减小；而当T增加至773K时，Dr异常增加。本文根据表面扩散、晶粒长大、缺陷形成等机制对其进行了分析。
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| 关 键 词： | 铜膜 表面形貌 分形 退火 |
Fractal properties of surface morphology of Cu films annealed at different temperature |
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| LUO Xiang-dong,LUO Chong-tai.Fractal properties of surface morphology of Cu films annealed at different temperature[J].Journal of Chinese Electron Microscopy Society,2009,28(3):209-213. |
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| Authors: | LUO Xiang-dong LUO Chong-tai |
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| Affiliation: | 1;2;1.Peili Technical College of Lanzhou City University;Lanzhou Gansu 730070;China;2.Lanzhou Physics Institute of China Academy of Space Technology;Lanzhou Gansu 730000;China |
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| Abstract: | 500 nm-thick Cu thin films were deposited on Si substrates by magnetron sputtering technology and then annealed under different temperatures T.Film surface morphologies were investigated using scanning electron microscope(SEM) and atomic force microscope(AFM).The results show that,with increasing T in the range of <673 K,the fractal dimension D_f of film surface decreases gradually. For the film annealed at T=773 K,D_f increases abruptly.The film surface morphology was analyzed based on surface diffusion,gr... |
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| Keywords: | Cu film surface morphology fractal annealing |
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