| 纳米银包覆铜粉体的制备及其导电性能研究 |
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| 引用本文： | 孙春桃,吴士筠. 纳米银包覆铜粉体的制备及其导电性能研究[J]. 化学与生物工程, 2003, 20(6): 27-28 |
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| 作者姓名： | 孙春桃 吴士筠 |
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| 作者单位： | 中南民族大学化学与生命科学学院,湖北,武汉,430074 |
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| 摘 要： | 利用水合肼还原制备出粒径分布均匀的铜纳米粉,并对其表面镀银的方法进行了探索。
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| 关 键 词： | 纳米 铜粉 镀银 导电性 |
| 文章编号： | 1672-5425(2003)06-0027-02 |
| 修稿时间： | 2003-11-20 |
The Preparation of Nanometer Silver-plating Copper Powder and the Study of Its Conducting Properties |
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| SUN Chun-tao,WU Shi-jun. The Preparation of Nanometer Silver-plating Copper Powder and the Study of Its Conducting Properties[J]. Chemistry & Bioengineering, 2003, 20(6): 27-28 |
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| Authors: | SUN Chun-tao WU Shi-jun |
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| Abstract: | The size distribution improvement of nanometer copper powders were prepared by chemical reduction method in aqueous solutions, using hydrazine hydrate as a reductive agent, and a method of plating silver on the surface of copper powder has been studied. |
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| Keywords: | nanometer copper powder silver-plating conducting properties |
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