| 交流电作用下Au薄膜热疲劳失效行为的研究 |
| |
| 引用本文： | 王鸣,张滨,刘常升,张广平.交流电作用下Au薄膜热疲劳失效行为的研究[J].金属学报,2011(5). |
| |
| 作者姓名： | 王鸣 张滨 刘常升 张广平 |
| |
| 作者单位： | 东北大学材料与冶金学院材料各向异性与织构教育部重点实验室;中国科学院金属研究所沈阳材料科学国家(联合)实验室; |
| |
| 基金项目： | 国家重点基础研究发展计划资助项目2010CB631003~~ |
| |
| 摘 要： | 本文研究了交流电致循环热应变作用下200 nm厚Au薄膜的失效行为.结合实验结果和理论计算,确定了交流电作用下6μm宽Au薄膜导线上的温度分布,并由此确定了Au互连线在交流电作用下达到稳定状态后的循环热应变范围.结果表明,应变范围△ε≤0.35%,经过5×10~6cyc热循环后,Au互连线中的晶粒出现不同程度的增长,晶界损伤导致Au互连线的最终失效.对Au薄膜热疲劳、机械疲劳失效行为及其机制进行了分析.
|
| 关 键 词： | Au薄膜 交流电 热疲劳 |
STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING |
| |
| WANG Ming,ZHANG Bin,LIU Changsheng,ZHANG Guangping Key Laboratory for Anisotropy , Texture of Materials,School of Materials , Metallurgy,Northeastern University,Shenyang Shenyang National Laboratory for Materials Science.STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING[J].Acta Metallurgica Sinica,2011(5). |
| |
| Authors: | WANG Ming ZHANG Bin LIU Changsheng ZHANG Guangping Key Laboratory for Anisotropy Texture of Materials School of Materials Metallurgy Northeastern University Shenyang Shenyang National Laboratory for Materials Science |
| |
| Affiliation: | WANG Ming~(1,2)),ZHANG Bin~(1)),LIU Changsheng~(1)),ZHANG Guangping~(2)) 1)Key Laboratory for Anisotropy and Texture of Materials(Ministry of Education),School of Materials and Metallurgy,Northeastern University,Shenyang 110819 2)Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,72 Wenhua Road,Shenyang 110016 |
| |
| Abstract: | Metallization interconnects in microelectronic integrated circuits usually fail during fabrication and long-term service under electrical,mechanical,or thermal field and coupled multi-field of them,such as electromigration(EM)failure induced by direct current,stress-induced voiding(SIV) damage and thermal fatigue under thermal cyclic strain,which affect the reliability of the interconnects. Although EM and SIV have been actively investigated for several decades,there is limited work on thermal cyclic strain... |
| |
| Keywords: | gold film alternating current thermal fatigue |
| 本文献已被 CNKI 等数据库收录！ |
|
