Thermal characteristics of graphite foam thermosyphon for electronics cooling |
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Authors: | Kyungbin Lim Hongkoo Roh |
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Affiliation: | (1) Department of Mechanical Engineering, Hanbat National University, San 16-1, 305-719 Dukmyung-dong, Yuseong-gu, Daejeon, Korea |
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Abstract: | Graphite foams consist of a network of interconnected graphite ligaments and are beginning to be applied to thermal management
of electronics. The thermal conductivity of the bulk graphite foam is similar to aluminum, but graphite foam has one-fifth
the density of aluminum. This combination of high thermal conductivity and low density results in a specific thermal conductivity
about five times higher than that of aluminum, allowing heat to rapidly propagate into the foam. This heat is spread out over
the very large surface area within the foam, enabling large amounts of energy to be transferred with relatively low temperature
difference. For the purpose of graphite foam thermosyphon design in electronics cooling, various effects such as graphite
foam geometry, sub-cooling, working fluid effect, and liquid level were investigated in this study. The best thermal performance
was achieved with the large graphite foam, working fluid with the lowest boiling point, a liquid level with the exact height
of the graphite foam, and at the lowest sub-cooling temperature. |
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Keywords: | Graphite Foam Electronics Cooling Thermosyphon |
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