| IC芯片粘片机的精度测量实验 |
| |
| 引用本文： | 吴志伟. IC芯片粘片机的精度测量实验[J]. 机电工程技术, 2009, 0(4): 43-45 |
| |
| 作者姓名： | 吴志伟 |
| |
| 作者单位： | 广东工贸职业技术学院,广东广州,510510 |
| |
| 基金项目： | 广东工贸职业技术学院项目 |
| |
| 摘 要： | 设计制造出IC芯片粘片机焊头机构的实验平台．采用图像处理的方式来测量焊头的运动精度和定位精度等参数。实验结果表明：所设计的机构能满足IC芯片粘片机的工作要求，各项性能指标均达到了设计标准。
|
| 关 键 词： | 实验 焊头机构 图像处理 |
Accuracy Measuring Experiment of IC Chip Die |
| |
| WU Zhi-wei. Accuracy Measuring Experiment of IC Chip Die[J]. Mechanical & Electrical Engineering Technology, 2009, 0(4): 43-45 |
| |
| Authors: | WU Zhi-wei |
| |
| Affiliation: | Guangdong Vocational College of Industry & Commerce;Guangzhou 510510;China |
| |
| Abstract: | An experimental platform of the IC die bonder has been manufactured,and parameters such as moving precision and position accuracy have been measured by using image recognition technology.The experimental results indicate that the designed mechanism can meet the working requirements of the IC die and the performance indexes can satisfied the design standards. |
| |
| Keywords: | experiment bonder image recognition technology |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
