| 电子塑封用脂环族环氧树脂研究进展 |
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| 引用本文： | 张小华,张志森,徐伟箭,熊远钦.电子塑封用脂环族环氧树脂研究进展[J].热固性树脂,2006,21(3):47-49,53. |
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| 作者姓名： | 张小华 张志森 徐伟箭 熊远钦 |
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| 作者单位： | 湖南大学化学化工学院,湖南,长沙,410082 |
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| 摘 要： | 结合电子封装的现状、电子塑封材料的发展以及电子封装对塑封材料提出的高性能要求,介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景,其包括耐热型液体、含磷三官能团型、有机硅多官能团脂环族环氧树脂。同时简略介绍了脂环族环氧树脂增韧改性研究动向。
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| 关 键 词： | 电子封装 电子塑封材料 脂环族环氧树脂 环氧化 |
| 文章编号： | 1002-7432（2006）03-0047-04 |
| 收稿时间： | 2005-09-30 |
| 修稿时间： | 2005-09-30 |
Research advancess of alicyclic epoxy for electronic encapsulate materials |
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| ZHANG Xiao-hua,ZHANG Zhi-sen,XU Wei-jian,XIONG Yuan-qin.Research advancess of alicyclic epoxy for electronic encapsulate materials[J].Thermosetting Resin,2006,21(3):47-49,53. |
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| Authors: | ZHANG Xiao-hua ZHANG Zhi-sen XU Wei-jian XIONG Yuan-qin |
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| Affiliation: | College of Chemical and Engineeing, Hunan Univerisity, Changsha 410082 , China |
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| Abstract: | In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs. It included the heat - resistant liquid alicyclic epoxy, the trifunctional alicyclic epoxy cotaining phosphorus in molecular chain, polyfunctional alicyclic epoxy resin containing silicon in molecular chain and its trends of toughnening modification was simply described. |
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| Keywords: | electronic packaging encapsulating material alicyclic epoxy resin epoxization |
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