| 喷射成形硅铝电子封装材料的电镀及钎焊性能 |
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| 引用本文： | 李志辉,张永安,熊柏青,刘红伟,魏衍广,张济山.喷射成形硅铝电子封装材料的电镀及钎焊性能[J].稀有金属,2010,34(5). |
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| 作者姓名： | 李志辉 张永安 熊柏青 刘红伟 魏衍广 张济山 |
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| 作者单位： | 1. 北京有色金属研究总院有色金属材料制备加工国家重点实验室,北京,100088
2. 北京科技大学新金属材料国家重点实验室,北京,100083 |
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| 基金项目： | 国家"863"计划项目资助，新金属材料国家重点实验室开放基金 |
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| 摘 要： | 喷射成形高硅铝合金材料因具有低热膨胀系数、高热导率和低密度等特性,而成为一种具有广阔应用前景的新型电子封装材料。然而,喷射成形硅铝系合金中硅含量很高,其焊接性能较差。采用镀金、钎焊的方法研究了喷射成形硅铝合金材料的电镀及焊接性能;用扫描电镜对镀层及钎焊层形貌进行观察,用能谱仪对镀层及焊接层进行成分线扫描分析。结果表明,喷射成形硅铝合金材料易于电镀,电镀后镀层致密、均匀,与基体之间结合良好;焊接之前对喷射成形硅铝合金进行电镀可改善其与焊料之间的润湿性,材料焊接性能得以显著改善,可满足电子技术行业对封装材料的焊接工艺性能要求。
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| 关 键 词： | 电子封装 硅铝合金 电镀 钎焊 喷射成形 |
Plating and Brazing Performance of Spray-Formed Si-Al Materials for Electronic Packaging |
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| Li Zhihui,Zhang Yongan,Xiong Baiqing,Liu Hongwei,Wei Yanguang,Zhang Jishan.Plating and Brazing Performance of Spray-Formed Si-Al Materials for Electronic Packaging[J].Chinese Journal of Rare Metals,2010,34(5). |
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| Authors: | Li Zhihui Zhang Yongan Xiong Baiqing Liu Hongwei Wei Yanguang Zhang Jishan |
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| Affiliation: | Li Zhihui1,Zhang Yongan1,Xiong Baiqing1,Liu Hongwei1,Wei Yanguang1,Zhang Jishan2 (1.State Key Laboratory for Fabrication and Processing of Non-Ferrous Metals,General Research Institute for Non-Ferrous Metals,Beijing 100088,China,2.State Key Laboratory for Advanced Metals and Materials,University of Science and Technology Beijing,Beijing 100083,China) |
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| Abstract: | Spray-formed Si-Al alloys were one kinds of the novel electronic packaging materials due to their lower thermal expansion coefficients,high heat conductivity and lower density,which made it an extensive prospect for application.Unfortunately,the brazing performance of Si-Al series alloys was found to be very poor due to very high silicon content.The plating and brazing performance of spray-formed Si-Al Materials were studied.Scanning electron microscopy was used to characterize the morphologies of the plati... |
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| Keywords: | electronic packaging Si-Al alloy plating brazing spray forming |
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