| 射频微系统2. 5D/3D 封装技术发展与应用 |
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| 引用本文： | 崔凯,王从香,胡永芳. 射频微系统2. 5D/3D 封装技术发展与应用[J]. 电子机械工程, 2016, 32(6): 1-6 |
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| 作者姓名： | 崔凯 王从香 胡永芳 |
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| 作者单位： | 南京电子技术研究所,南京电子技术研究所,南京电子技术研究所 |
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| 摘 要： | 2. 5D/3D 封装技术是满足未来射频系统更高集成度、更高性能、更高工作频率需求的主要手段。文中介绍了目前微系统2. 5D/3D 封装技术的发展趋势及硅通孔(TSV)、微凸点/ 铜柱、圆片级封装等先进的高密度封装技术,并关注了2. 5D/3D 封装技术在射频微系统领域的应用及挑战,为射频微系统集成封装技术研究提供参考。
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| 关 键 词： | 2. 5D/3D 封装 射频微系统 硅通孔 圆片级封装 热管理 |
Development and Application of 2. 5D / 3D Packaging Technology for RF Microsystem |
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| CUI Kai,WANG Cong-xiang and HU Yong-fang. Development and Application of 2. 5D / 3D Packaging Technology for RF Microsystem[J]. Electro-Mechanical Engineering, 2016, 32(6): 1-6 |
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| Authors: | CUI Kai WANG Cong-xiang HU Yong-fang |
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| Affiliation: | Nanjing Research Institute of Electronics Technology,Nanjing Research Institute of Electronics Technology and Nanjing Research Institute of Electronics Technology |
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| Abstract: | 2. 5D/3D packaging technology is the main method for future RF system demands such as higher integration, better system performance, higher operating frequency. In this paper, the development trend of microsystem 2. 5D/3D packaging technology and advanced high density packaging technologies such as TSV,micro-bump/ copper pillar, wafer level package are introduced. The application and challenge of 2. 5D/3D packaging technology in the field of RF microsystem are also discussed to provide a reference for the research of RF microsystem integration and packaging technology. |
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| Keywords: | 2.5D/3D packaging RF microsystem through silicon via (TSV) wafer level package (WLP) thermal management |
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