Quality-oriented optimization of wave soldering process by using self-organizing maps

In this paper, the optimal process parameters of a wave soldering process were defined. The optimization was performed in respect to soldering quality by minimizing a cost function describing the total repairing cost of a wave-soldered printed circuit board (PCB). The data analysis stages were as follows. First, the process data were coded into inputs for a self-organizing map (SOM). Next, a function for the repairing cost was constructed and used to find the optimal map neurons. At the last phase, the optimal parameters were approximated on the basis of the reference vectors of the optimal neurons. The results showed clearly potential in the optimization of the wave soldering process, especially in the visualization of the optimal process conditions. Therefore, it would be useful to exploit the method more widely in the electronics industry.