新型图形化 SOI LDMOS结构的性能分析

提出一种图形化SOILDMOSFET结构,埋氧层在器件沟道下方是断开的,只存在于源区和漏区.数值模拟结果表明,相对于无体连接的SOI器件,此结构的关态和开态击穿电压可分别提高57%和70%,跨导平滑,开态I-V曲线没有翘曲现象,器件温度低100K左右,同时此结构还具有低的泄漏电流和输出电容.沟道下方开硅窗口可明显抑制SOI器件的浮体效应和自加热效应.此结构具有提高SOI功率器件性能和稳定性的开发潜力.

A Novel LDMOS Structure in Thin Film Patterned-SOI Technology with a Silicon Window Beneath p Well

A novel patterned-SOI LDMOS structure with a silicon window beneath the p well is proposed.The performance is simulated numerically.In comparison to SOI counterpart,the off-state and the on-state breakdown voltage can increase by 57% and 70% respectively;transconductance is flatter;I-V curves take no sign of kink in the saturation region;the device temperature is much lower even at high input power;the floating body effect and the self-heating effect are distinctly suppressed.Furthermore,the advantage of low leakage current and low output capacitance in SOI structures does not degrade.The proposed structure will be a promising choice to improve the performance and reliability of SOI power device.