Accelerated life test of high power white light emitting diodes based on package failure mechanisms |
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| Authors: | SI Chan WS Hong KT Kim YG Yoon JH Han JS Jang |
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| Affiliation: | 1. Reliability Physics Research Center, Korea Electronic Technology Institute, Seongnam, Republic of Korea;2. Department of Industrial Engineering, Graduate School of Ajou University, Suwon, Republic of Korea;3. Reliability Assessment Team, Korea Testing Certification, Gunpo, Republic of Korea;4. Division of Industrial and Information System Engineering, Ajou University, Suwon, Republic of Korea;1. CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France;2. Department of Microelectronics, Czech Technical University in Prague, Czech Republic;3. TNO, P.O. Box 6235, 5600 HE Eindhoven, The Netherlands;4. Instituto de Microelectrónica de Barcelona-Centro Nacional de Microelectrónica, IMB-CNM (CSIC), Campus UAB, Bellaterra, Spain;5. Boschman Technologies, Stenograaf 3, 6921 EX Duiven, The Netherlands;6. Philips Lighting, LED Platform Development, Mathildelaan 1, 5611 BD Eindhoven, The Netherlands;1. Department of Industrial Engineering, University of Bologna, v.le Risorgimento 2, Bologna, 40136, Italy;2. Department of Management and Engineering, University of Padua, stradella San Nicola 3, 36100 Vicenza, Italy |
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| Abstract: | Accelerated life tests of high-power white light emitting diodes (LEDs) were conducted under an unbiased highly accelerated temperature and humidity test (HAST) and a normal aging test. The conditions in the unbiased HAST were 110 °C-85% RH, 130 °C-85% RH without bias. During the aging, the degradation mechanisms of optical power reduction and degradation of 455 mm blue wavelengths that were better than phosphors related yellow emission bands were observed. The microscopy analysis showed that this effect could be ascribed to the bubbling and discoloration of the silicone encapsulating material of the package. It is thought that these features are also responsible for the optical power reduction and thermal resistance increase. |
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