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An experimental investigation of a three-dimensional flat-plate oscillating heat pipe with staggered microchannels
Authors:S.M. Thompson  P. Cheng  H.B. Ma
Affiliation:1. Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA;2. ThermAvant Technologies, Columbia, MO 65201, USA;1. Green Energy and Environment Research Lab, Industrial Technology Research Institute, Hsinchu 31040, Taiwan;2. Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung 80778, Taiwan;1. Institut Pprime CNRS – ENSMA – Université de Poitiers, UPR 3346, Département Fluides, Thermique, Combustion, ENSMA, 1 av. Clément Ader, BP40109, 86961 Futuroscope-Chasseneuil Cedex, France;2. Politecnico di Milano, Dipartimento di Energia, Via Lambruschini 4A, 20158 Milano, Italy;3. Università di Bergamo, Dipartimento di Ingegneria e Scienze Applicate, Viale Marconi 5, 24044 Dalmine, Italy;4. University of Brighton, School of Computing, Engineering and Mathematics, Lewes Road, BN2 4GJ Brighton, UK;5. Università di Pisa, DESTEC, Largo L. Lazzarino 2, Pisa, Italy
Abstract:Using water or acetone as the working fluid, the thermal performance of a three-dimensional flat-plate oscillating heat pipe (3D FP-OHP) with staggered microchannels was experimentally investigated by varying heating area, cooling temperature and operating orientation. It was found that when the heating area is larger at the same input power, the heat pipe is less orientation-dependent. When the heating area was decreased, to form a localized heating condition and higher heat flux, the thermal resistance and peak-to-peak amplitudes of temperature oscillations in the evaporator increased. The utilization of water as the working fluid generally provided the lowest thermal resistance for all experimental conditions investigated, but – unlike acetone – resulted in more severe temperature fluctuations in the evaporator during localized heating. The 3D FP-OHP, with overall dimensions of 130.18 × 38.10 × 2.86 mm3, demonstrated to efficiently manage heat fluxes as high as approximately 300 W/cm2 at a total heat load of 300 W.
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