| 铝及铝合金电镀高可焊性锡基合金工艺 |
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| 引用本文： | 钟建武.铝及铝合金电镀高可焊性锡基合金工艺[J].材料保护,2002,35(11):41-43. |
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| 作者姓名： | 钟建武 |
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| 作者单位： | 驻二八二厂军事代表室,湖南,湘潭,411207 |
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| 摘 要： | 重点对比了用浸锌、浸镍和磷酸阳极氧化两种铝及铝合金电镀前处理方法得到的锡基镀层的孔隙率，结合力、抗高温高湿性能、抗中性盐雾试验性能，分析了铝及铝合金锡基镀层在长期贮存过程中易变色、生霉、泛黑的原因，推荐了一种在铝及铝合金上电镀高抗变色性、高结合力、高可焊性的锡基镀层工艺。
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| 关 键 词： | 铝 铝合金 电镀 高可焊性 锡基合金 工艺 |
| 文章编号： | 1001-1560(2002)11-0041-03 |
High Solderability Tin alloy Electroplating Technology for Aluminum and Its Alloy |
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| ZHONG Jian-wu.High Solderability Tin alloy Electroplating Technology for Aluminum and Its Alloy[J].Journal of Materials Protection,2002,35(11):41-43. |
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| Authors: | ZHONG Jian-wu |
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| Abstract: | The properties of tin coatings, including porosity, adhesion force, high temperature resistance, high humidity resistance, neutral salt spraying resistance, were compared for two kinds of aluminum and aluminum alloys pretreated by zinc-dipping, Ni-dipping and phosphate anodizing. The tarnish of tin coating during long storage was analyzed. The tin-base plating technology on aluminum and aluminum alloy was recommended for its high anti-tarnish, high adhesion force and high solderability. |
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| Keywords: | aluminum and aluminum alloy phosphate anodizing high solderability high adhesion force bright tin and cerium |
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