| 免清洗型助焊剂的研究进展 |
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| 引用本文： | 金霞,冒爱琴,顾小龙. 免清洗型助焊剂的研究进展[J]. 电子工艺技术, 2007, 28(6): 334-337 |
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| 作者姓名： | 金霞 冒爱琴 顾小龙 |
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| 作者单位： | 浙江省冶金研究院亚通电子有限公司,浙江,杭州,310021;安徽工业大学,安徽,马鞍山,243002 |
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| 摘 要： | 根据助焊剂的发展趋势,介绍了免清洗助焊剂的概念、分类及可靠性评价的方法,综述了国内外科研工作者对制备免清洗助焊剂的研究进展状况,并指出了免清洗助焊剂在使用时急需注意的事项,最后阐述了无铅焊料用免清洗型助焊剂是近年来的研究热点.
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| 关 键 词： | 免清洗 助焊剂 焊接性能 |
| 文章编号： | 1001-3474（2007）06-0334-04 |
| 收稿时间： | 2007-08-25 |
| 修稿时间： | 2007-08-25 |
Development Progress of No - clean Flux |
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| JIN Xia,MAO Ai-qin,GU Xiao-long. Development Progress of No - clean Flux[J]. Electronics Process Technology, 2007, 28(6): 334-337 |
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| Authors: | JIN Xia MAO Ai-qin GU Xiao-long |
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| Abstract: | The conception, classification, the reliability evaluation methods of no - clean flux are introduced, according to the latest development trends of flux. Recent advances of research of no - clean flux in side and out side of China are also summarized. The problems which was found in using of no - clean flux are pointed out. At last representing no - clean flux for lead - free solder has been become the focus of study recently. |
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| Keywords: | No - clean Flux Soldering properties |
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