| 浅谈铜含量对热风无铅焊料整平可焊性的影响 |
| |
| 引用本文： | 周定忠,李飞宏,龙亚波.浅谈铜含量对热风无铅焊料整平可焊性的影响[J].印制电路信息,2013(1):59-62. |
| |
| 作者姓名： | 周定忠 李飞宏 龙亚波 |
| |
| 作者单位： | 胜华电子(惠阳)有限公司 |
| |
| 摘 要： | 为适应欧盟、美国和我国对铅等重金属有毒物质使用的限制,电子组件中传统的有铅热风焊料整平PCB已经逐渐向无铅热风焊料整平PCB转化,而在热风焊料整平工艺中锡槽中铜含量的管控对于可焊性的好坏具有决定性作用。本文重点介绍了热风无铅焊料整平工艺中铜离子的提取和控制方法,解决热风无铅焊料整平因铜含量过高导致的可焊性不良之问题。
|
| 关 键 词： | 铜含量 除铜 可焊性 热风焊料整平 |
Discussion on influence of the copper content to the HASL solderability |
| |
| ZHOU Ding-zhong,LI Fei-hong,LONG Ya-bo.Discussion on influence of the copper content to the HASL solderability[J].Printed Circuit Information,2013(1):59-62. |
| |
| Authors: | ZHOU Ding-zhong LI Fei-hong LONG Ya-bo |
| |
| Affiliation: | ZHOU Ding-zhong LI Fei-hong LONG Ya-bo |
| |
| Abstract: | In order to adapt to the European Union,the United States and China＇s restriction to toxic substances such as lead as heavy metals,the traditional electronic lead HASL PCB has gradually change to lead-free hot air solder leveling.In hot air solder leveling process in tin bath,the copper content control for solder flux is good or bad has the decisive role.This paper introduces lead-free hot air solder leveling process copper ion extraction and control method,to solve the lead-free hot air solder leveling for high copper content problem. |
| |
| Keywords: | Copper Content Except for Copper Solder Hot Air Solder Leveling |
| 本文献已被 CNKI 维普 等数据库收录！ |
