双色电器外壳的注射成型

利用专业模流分析软件Moldflow/MPI，对双色电器外壳的注射成型填充过程进行了模拟分析。结果表明，内、外层壳体的最佳浇口位置均位于底部外表面圆心处；气穴易出现在制品边缘；翘曲主要表现为径向翘曲。还对内外层壳体的填充时间、冷却时间、体收缩率等进行分析比较，确定了最大注射压力等主要工艺参数，从而使双色电器外壳的注射成型工艺和模具结构得到优化。

Injection Molding of Two-color Electrical Enclosures

Using professional software for mold flow analysis Moldflow/MPI, the filling process of two-color electrical enclosure was simulated. It showed that the optimal locations of both inner and outer enclosure were located at the center of undersurfaces. Air traps trended to occur at the edge of products; main warpage was presented as radial warpage. The filling time, cooling time, maximum injection pressure, and volumetric shrinkage were analyzed and thus optimized the injection process and molding die structure of two-color electrical enclosure.