大功率LED灯具散热装置的设计

采用APDL语言生成分析文件,建立了LED灯具热沉的有限元模型,以热沉翘片长度、宽度和数目为设计变量,以LED最高结温为目标函数,建立了优化数学模型,采用ANSYS热分析软件进行了优化。结果表明热沉翘片长度越长,芯片最高结温越低;翘片宽度越宽,芯片最高结温越高;随着翘片数目增加,最高结温下降,但到达一定数值时,结温又会缓慢增大。在LED芯片结温不超过60℃的条件下,对热沉结构的优化值分别为：翘片长度为62.5mm,翘片宽度为1mm,翘片数目为20。

Design on Thermal Solution of High Power LED Lamps

Using APDL language to generate the analytic file, it establishes the finite element model for the LED lamp heat sink. Using length, width and numbers of the heat sink fins as the design variables and the LED maximum junction temperature as the objective function, the optimized mathematical model is established and analyzed by ANSYS thermal analysis software. The results show that the longer the length of heat sink fins, the lower the maximum junction temperature of the chip ; the wider the fins width, the higher the maximum chip junction temperature; with the increasing of the numbers of fins, the maximum junction temperature will go down; but when reaching a certain value, the junction temperature will slowly increase again. Under the conditions of the LED chip junction temperature not exceeding 60 ℃ , the heat sink structure optimized values are： fin length is 62. 5mm, fin width is lmm, the number of fins is 20.