Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder |
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| Authors: | Yu-Yan Chiang Robbin Cheng Albert T Wu |
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| Affiliation: | (1) College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016 Nanjing, China; |
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| Abstract: | This study investigated the effects of adding Bi and In to Sn-3Ag Pb-free solder on undercooling, interfacial reactions with
Cu substrates, and the growth kinetics of intermetallic compounds (IMCs). The amount of Sn dominates the undercooling, regardless
of the amount or species of further additives. The interfacial IMC that formed in Sn-Ag-Bi-In and Sn-In-Bi solders is Cu6Sn5, while that in Sn-Ag-In solders is Cu6(Sn,In)5, since Bi enhances the solubility of In in Sn matrices. The activation energy for the growth of IMCs in Sn-Ag-Bi-In is nearly
double that in Sn-Ag-In solders, because Bi in the solder promotes Cu dissolution. The bright particles that form inside the
Sn-Ag-In bulk solders are the ζ-phase. |
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