SINTERING KINETICS OF OXIDE-FILMCOATED COPPER POWDER

Abstract

The sintering kinetics of pure copper powder and of copper powder coated with a critical oxide (CU₂O) film thickness (～,500Å), has been studied by following the densification of the compacts as a function of temperature and time in pure dry hydrogen and in vacuum. The activation energy for the sintering of pure copper powder in hydrogen was 55,000 cal/mole, suggesting that the volume self-diffusion mechanism predominates during the sintering process. In the case of the oxide-coated powder the corresponding value was 37,000 cal/mole. The high rate of sintering of the coated powder in hydrogen and in vacuum is explained in terms of an activated sintering mechanism.