首页 | 本学科首页   官方微博 | 高级检索  
     


Control of Oxygen Permeability in Alumina under Oxygen Potential Gradients at High Temperature by Dopant Configurations
Authors:Satoshi Kitaoka  Tsuneaki Matsudaira  Masashi Wada  Tomohiro Saito  Makoto Tanaka  Yutaka Kagawa
Affiliation:1. Japan Fine Ceramics Center, , Nagoya, 456‐8587 Japan;2. Research Center for Advanced Science and Technology, The University of Tokyo, , Tokyo, 153‐8904 Japan
Abstract:The oxygen permeability of polycrystalline α‐alumina wafers, which served as models for alumina scales on alumina‐forming alloys, under steep oxygen potential gradients (urn:x-wiley:00027820:media:jace12935:jace12935-math-0001) was evaluated at 1873 K. Oxygen permeation occurred by the grain‐boundary (GB) diffusion of oxygen from the higher‐oxygen‐partial‐pressure (urn:x-wiley:00027820:media:jace12935:jace12935-math-0002) surface to the lower‐urn:x-wiley:00027820:media:jace12935:jace12935-math-0003 surface, along with the simultaneous GB diffusion of aluminum in the opposite direction. The fluxes of oxygen and aluminum at the outflow side of the wafer were significantly larger than at the inflow side. Furthermore, Lu and Hf segregation at the GBs selectively reduced the mobility of oxygen and aluminum, respectively. A wafer with a bilayer structure, in which a Lu‐doped layer was exposed to a lower urn:x-wiley:00027820:media:jace12935:jace12935-math-0004 and an Hf‐doped layer was exposed to a higher urn:x-wiley:00027820:media:jace12935:jace12935-math-0005, decreased the oxygen permeability. When the sign of urn:x-wiley:00027820:media:jace12935:jace12935-math-0006 was reversed, however, the oxygen permeability of the wafer was comparable to that of a nondoped wafer. Co‐doping with both Lu and Hf markedly increased the oxygen permeation, presumably because the Lu‐stabilized HfO2 particles that were segregated at the GBs acted as extremely fast diffusion paths for oxygen through the large number of oxygen vacancies introduced by the solid solution of Lu in the particles.
Keywords:
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号