| 下一代环保PCB产品应用技术 |
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| 引用本文： | 陈淑华,吴荣. 下一代环保PCB产品应用技术[J]. 印制电路信息, 2005, 0(6): 13-16 |
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| 作者姓名： | 陈淑华 吴荣 |
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| 作者单位： | 苏州华扬电子有限公司,215132 |
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| 摘 要： | 备受全球关注的WEEE/RoHS法案将于2006年7月1日正式生效,文章从原材料、制程管控及SMT后封装三个方面,多视角的分析下一代PCB环保产品,如何去满足日趋严格的环保技术要求。
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| 关 键 词： | 电子封装 无卤 无铅 环境保护 |
Next Generation Environment Friendly PCB Product |
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| Chen Shuhua,Wu Rong. Next Generation Environment Friendly PCB Product[J]. Printed Circuit Information, 2005, 0(6): 13-16 |
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| Authors: | Chen Shuhua Wu Rong |
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| Affiliation: | Chen Shuhua Wu Rong |
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| Abstract: | Many people paid attention to the world the WEEE/ RoHS the bill will formally produce effect on July 1in 2006, and this text is from the original material, manufacturing process to seal to pack three aspects after take care forthe control and SMT, much analysis the next generation PCB that see the cape product, how to face gradually andstrictly of environmental protection technique request. |
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| Keywords: | electronic package halogen free lead free environment-conservation |
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