| 集成电力电子模块封装的关键技术 |
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| 引用本文： | 王建冈,阮新波. 集成电力电子模块封装的关键技术[J]. 电子元件与材料, 2008, 27(4): 1-5 |
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| 作者姓名： | 王建冈 阮新波 |
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| 作者单位： | 盐城工学院,电气与信息工程学院,江苏,盐城,224051;南京航空航天大学,自动化学院,江苏,南京,210016;南京航空航天大学,自动化学院,江苏,南京,210016 |
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| 摘 要： | 封装技术直接影响到集成电力电子模块(Integrated Power Electronics Module,IPEM)的电气性能、EMI特性和热性能等,被公认为未来电力电子技术发展的核心推动力。介绍了IPEM封装的结构与互连和基板技术等关键技术及研究现状,分析了已存在的薄膜覆盖封装技术等三维IPEM封装技术,讨论了IPEM封装的发展趋势,最后指出我国IPEM封装技术研究的限制因素与对策。
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| 关 键 词： | 电子技术 封装 综述 集成电力电予模块 互连技术 |
| 文章编号： | 1001-2028(2008)04-0001-05 |
| 修稿时间： | 2007-12-18 |
Key technologies for packaging of integrated power electronics module |
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| WANG Jian-gang,RUAN Xin-bo. Key technologies for packaging of integrated power electronics module[J]. Electronic Components & Materials, 2008, 27(4): 1-5 |
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| Authors: | WANG Jian-gang RUAN Xin-bo |
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| Affiliation: | WANG Jian-gang1,2,RUAN Xin-bo2 (1. College of Electrical , Information Engineering,Yancheng Institute of Technology,Yancheng 224051,Jiangsu Province,China,2. College of Automation Engineering,Nanjing University of Aeronautics & Astronautics,Nanjing 210016,China) |
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| Abstract: | The package technology,which impacts on electrical,EMI and thermal characteristics of integrated power electronics module (IPEM),is considered as a central driver in future power electronics technology. The key technologies of IPEM packaging such as structure and interconnecting technology,substrate technology were introduced and the existing three-dimensional packaging technologies for IPEM were analyzed and compared. The developmentae trends of IPEM packaging were discussed. The limiting factors and the c... |
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| Keywords: | electron technology packaging review integrated power electronics module (IPEM) interconnection technology |
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