国际金融危机下封装测试行业面临的挑战

受国际金融危机影响，2008年国内集成电路产业增长率大幅度滑坡，封装测试行业也同样面临巨大挑战。文章分析了2008年国内集成电路产业尤其是江苏省集成电路产业的发展现状，封测业仍保持增长，但也出现明显下滑。原因不仅有国际环境的影响，还与国内集成电路产业特点有关。文章进一步探讨了金融危机的特点和对国内半导体行业的影响，以及国家目前为应对危机出台的各项政策。在此基础上，文章预测2009年半导体业将继续下降，但中国的半导体产业会先于全球半导体产业恢复，并高于全球半导体产业的增长幅度。最后，文章从技术、人才和资金三方面提出了封装测试业应对危机的措施，强调走出这次产业低谷的关键还是要依靠政府的强有力政策措施，即快速拉动国内需求。

The Challenge Faced by the IC Packaging and Testing Industry under the International Financial Crisis

Affected by the international financial crisis, the growth rate of the domestic IC industry greatly declined in 2008, IC packaging and testing industry were also facing a serious challenge. This article analyzes the development of the domestic IC industry, in particular the Jiangsu Province’s IC industry in 2008.IC packaging and testing industry were still growing, but also obviously declined. The reasons were not only the impact of international environment, but also the features of the domestic IC industry. The article makes a further discussion of the characteristics of the financial crisis and its impact on the domestic semiconductor industry, as well as the policies formulated by the country in response to the current crisis. On this basis, the article forecasts the semiconductor industry in 2009 will continue to fall, but China’s semiconductor industry will recovery earlier with a higher growth rate than the global semiconductor industry. Finally, from the three aspects of technology, talent and fund, the article proposes some measures for IC packaging and testing industry to deal with the crisis, stressing that the key for the domestic IC industry out of its slump are the strong policy measures formulated by the government, that is, expanding domestic demand as soon as possible.