Crack Growth in Silica Glass Under Dynamic Loading |
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| Authors: | YOSHINORI HIBINO SHIGEKI SAKAGUCHI YOSHIMITSU TAJIMA |
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| Affiliation: | Ibaraki Electrical Communication Laboratory, Nippon Telegraph and Telephone Public Corporation, Tokai, Ibaraki 319–11, Japan |
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| Abstract: | A dynamic loading test at a slow strain rate was made to examine the stable crack-growth process in silica glass under several environmental conditions. The temperature and humidity influence on the crack-growth process was investigated in detail. Test results show that the transition from region I to region II occurs at a constant stress intensity factor, K , independent of temperature and humidity. The transition K value was determined to be 0.61 MPa.m1/2. Furthermore, it is clear that the crack-growth rate is dependent on K , even in region II. |
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