| SnAgCu-xPr钎料组织及性能 |
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| 引用本文： | 皋利利,薛松柏,许辉.SnAgCu-xPr钎料组织及性能[J].焊接学报,2012,33(1):69-72. |
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| 作者姓名： | 皋利利 薛松柏 许辉 |
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| 作者单位： | 南京航空航天大学材料科学与技术学院,南京,210016 |
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| 基金项目： | 2010年江苏省高等学校大学生实践创新训练计划基金资助项目 |
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| 摘 要： | 研究了不同含量Pr元素（质量分数分别为0,0.05%,0.5%）对Sn-3.8Ag-0.7Cu无铅钎料凝固特性、润湿铺展性能以及微观组织的影响.结果表明,SAC,SAC-0.05Pr以及SAC-0.5Pr的凝固所需过冷度分别为20.6,5.0,5.1℃,说明适量Pr元素的加入能够显著降低SnAgCu钎料凝固所需的过冷度;同时,Pr元素的加入细化了钎料组织,降低钎料组织中初晶β-Sn的尺寸,抑制了SnAgCu/Cu焊点内部不同形貌大块化合物Ag3Sn初晶的形成;当Pr元素的添加量为0.05%时,钎料润湿性能最优、组织最佳;0.5%Pr元素的添加会在钎料以及焊点内部形成PrSn3相,对焊点的性能造成不利的影响.
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| 关 键 词： | 稀土镨 锡银铜钎料 凝固特性 润湿性能 显微组织 |
| 收稿时间： | 2011/6/13 0:00:00 |
Microstructure and properties of SnAgCu-xPr solder |
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| GAO Lili,XUE Songbai and XU Hui.Microstructure and properties of SnAgCu-xPr solder[J].Transactions of The China Welding Institution,2012,33(1):69-72. |
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| Authors: | GAO Lili XUE Songbai and XU Hui |
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| Affiliation: | (College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China) |
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| Abstract: | The effect of different Pr additions(0,0.05,0.5wt.%)on the solidification behavior,spreading property and microstructures of Sn-3.8Ag-0.7Cu(SAC) solder were investigated.The results showed that the undercooling of SAC,SAC-0.05Pr and SAC-0.5Pr solder in solidification were 23.2,7 and 8.6 ℃ respectively which indicated that the proper content of Pr addition could obviously decrease the undercooling of SAC solder.Meanwhile,with Pr addition,the microstructure of SAC solder was improved and the primary Ag3Sn plate in SAC/Cu solder joint was restrained.Moreover,the SAC-0.05Pr solder has the best wetting property and microstructure;when the Pr addition was up to 0.5 wt%,PrSn3 phase with large size formed in solder would deteriorate the property of SAC solder joint. |
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| Keywords: | rare earth Pr SnAgCu solder solidification behavior wettalility microstructure |
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