| 添加剂对化学镀铜层机械性能的影响 |
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| 引用本文： | 宋元伟,赵斌. 添加剂对化学镀铜层机械性能的影响[J]. 化学世界, 2000, 41(1): 13-18 |
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| 作者姓名： | 宋元伟 赵斌 |
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| 作者单位： | 1. 华东理工大学无机材料系,上海,200237
2. 华东理工大学化学系,上海,200237 |
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| 摘 要： | 通过在化学镀铜液中分别添加亚铁氰化钾、２ＭＢＴ及２，２’－联吡啶三种添加剂的实验研究，探讨了添加剂种类及其加入量对镀铜速度和镀铜层延展性产生显著影响的原因。此外，简要讨论了添加剂的加入对镀铜层的耐磨性产生影响的原因
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| 关 键 词： | 化学镀铜 添加剂 延展性 镀速 耐磨性 |
The Influence of Additives on the Mechanical Properties of Chemical Plating Copper Layer |
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| SONG Yuan-wei,ZHAO Bin. The Influence of Additives on the Mechanical Properties of Chemical Plating Copper Layer[J]. Chemical World, 2000, 41(1): 13-18 |
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| Authors: | SONG Yuan-wei ZHAO Bin |
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| Abstract: | The addition of additives K 4Fe(CN) 6,2MBT and dipyridyl into plating solutions was studied.It was found that they have effects on plating rate,ductility and antiwear of copper layer. |
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| Keywords: | chemical plating copper additives ductility plating rate antiwear property |
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