A low-power,micromachined, double spiral hotplate for MEMS gas sensors

This paper presents the design, fabrication and reliability testing of a double spiral platinum-based MEMS hotplate for gas sensing applications. The structure of MEMS hotplate consists of a 0.7 µm-thick thermally grown SiO₂ membrane of size 120 µm × 120 µm over which a double spiral platinum resistor is laid out. The hotplate membrane is supported by its four arms connected to the Si-substrate. The design and simulation of the hotplate structure was carried out using MEMS-CAD Tool COVENTORWARE. Based on the design, a double spiral platinum resistor of 103 Ω is fabricated on SiO₂ membrane using lift-off technique. The platinum deposition is carried out using DC sputtering technique. Bulk micromachining of Si is done from front side of the structure to create the suspended SiO₂ membrane. The temperature coefficient of resistance (TCR) of platinum is measured and found to be 2.19 × 10^?3/ °C. The TCR value is used for temperature estimation of the hotplate. The test results show that the microhotplate consumes only 20 mW power when heated up to 500 °C. For reliability testing of fabricated structure, the hotplate is continuously operated at 300 °C for 1.8 h. Also, it can sustain at least 61 cycles pulse-mode operation at 530 °C with ultra-low resistance and temperature drifts. The structure can sustain a maximum temperature and current of 611 °C and 11.55 mA respectively without any damage.