| Abstract: | The mechanism and kinetics of curing of epoxy resin with poly(m‐phenylene methylphosphonate) (PMP) was studied by extraction and swelling experiments, DSC, 31P NMR, and FTIR. It was shown that at linear heating of 20°C/min PMP cures bisphenol A type epoxy resin at 230–300°C, whereas in the presence of catalytic amount of 2‐methyl imidazole the curing occurs at 200–230°C. Under isothermal conditions, epoxy resin was cured with PMP after 40–70 min at 150°C. An unusual mechanism of curing due to opening and insertion of epoxy into the phosphonate bond was suggested. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 4011–4022, 2006 |
