| EMC中的两种接地技术 |
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| 引用本文： | 郭亚红.EMC中的两种接地技术[J].河北机电学院学报,2011(4):270-271,274. |
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| 作者姓名： | 郭亚红 |
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| 作者单位： | 漯河职业技术学院,河南漯河462002 |
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| 摘 要： | 电磁兼容接地设计有单点接地和多点接地2种基本方法,低频电路中要求用单点接地,高频电路中用多点接地,用多点接地设备如果不能通过EFT/B测试,可以尝试单点接地方法。实验证明,对某些高频电路完全可以用单点接地方法满足EMC要求。
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| 关 键 词： | 接地技术 EMC EFT/B |
Case analysis of EMC grounding technology |
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| Authors: | GUO Ya-hong |
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| Affiliation: | GUO Ya-hong (Luohe Vocational and Technical College,Luohe Henan 462002,China) |
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| Abstract: | The EMC grounding design consists of single-point grounding and multi-point grounding.Low-frequency circuits require single-point grounding,while multi-point grounding is usually used for equipments of high-frequency circuits.However,when the equipment can not pass the EFT/B test,single-point grounding can be used instead.Experiments prove that some high-frequency circuits can use single-point grounding to meet the EMC requirements. |
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| Keywords: | grounding technology EMC EFT/B |
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