Creep behavior of eutectic Sn-Cu lead-free solder alloy |
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Authors: | C M L Wu M L Huang |
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Affiliation: | (1) Department of Physics and Materials Science, City University of Hong Kong, Hong Kong SAR, People’s Republic of China;(2) Department of Materials Engineering, Dalian University of Technology, 116024 Dalian, People’s Republic of China |
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Abstract: | Tensile creep behavior of precipitation-strengthened, tin-based eutectic Sn-0.7Cu alloy was investigated at three temperatures
ranging from 303–393 K. The steady-state creep rates cover six orders of magnitude (10−3−10−8 s−1) under the stress range of σ/E=10−4−10−3. The initial microstructure reveals that the intermetallic compound Cu6Sn5 is finely dispersed in the matrix of β-Sn. By incorporating a threshold stress, σ
th, into the analysis, the creep data of eutectic Sn-Cu at all temperatures can be fitted by a single straight line with a slope
of 7 after normalizing the steady-state creep rate and the effective stress, indicating that the creep rates are controlled
by the dislocation-pipe diffusion in the tin matrix. So the steady-state creep rate,
, can be expressed as
exp
, where Qc is the activation energy for creep, G is the temperature-dependent shear modulus, b is the Burgers vector, R is the universal
gas constant, T is the temperature, σ is the applied stress, A is a material-dependent constant, and
, in which σ
OB is the Orowan bowing stress, and kR is the relaxation factor.
An erratum to this article is available at . |
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Keywords: | Creep eutectic Sn-Cu lead-free solder alloy precipitation strengthening activation energy |
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