| 如何获得优质的焊膏印刷（1） |
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| 引用本文： | 鲜飞. 如何获得优质的焊膏印刷（1）[J]. 印制电路信息, 2006, 0(8): 60-63 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,430074 |
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| 摘 要： | 焊膏印刷是SMT生产中关键工序之一,其控制直接影响着组装板的质量。介绍了焊膏印刷中影响质量的诸多因素并分析其原因,同时提出部分纠正措施和建议。
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| 关 键 词： | 焊膏 模板 印刷 表面贴装技术 缺陷 |
How to Obtain the Perfect Quality of Solder-Paste Printing(1) |
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| Xian Fei. How to Obtain the Perfect Quality of Solder-Paste Printing(1)[J]. Printed Circuit Information, 2006, 0(8): 60-63 |
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| Authors: | Xian Fei |
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| Abstract: | Solder-paste printing plays an important part in SMT production, affecting the quality of assemblies.The article introduces many factors of infecting quality in Solder-paste printing process and have analysed thosereasons, present some corrective actions and advice at the same time. |
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| Keywords: | solder-paste stencil printing SMT defect |
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