Quantitative Evaluation of Bulk and Interface Microstructures in Al-3003 Alloy Builds Made by Very High Power Ultrasonic Additive Manufacturing |
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Authors: | Hiromichi T Fujii M R Sriraman and S S Babu |
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Affiliation: | (1) Department of Material Science and Engineering, The Ohio State University, Columbus, OH 43221, USA;(2) Department of Materials Processing, Graduate School of Engineering, Tohoku University, Sendai 908-8579, Japan |
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Abstract: | Ultrasonically consolidated 3003 aluminum alloy builds were prepared with constituent tapes by using a very high power ultrasonic
additive manufacturing (UAM) process. Microstructures of interface and bulk regions were quantitatively characterized using
the electron backscattered diffraction technique. The interface microstructure consists of equiaxed grains. The 〈111〉 crystallographic
directions of these grains were aligned with the normal direction of the specimen, confirming a shear deformation mode at
these regions. In addition, due to recrystallization, the density of low-angle grain boundaries also significantly decreased.
In contrast, original elongated grains and partially recrystallized grains were observed in the bulk region of the tape. These
elongated grains correspond to rolling texture components of face-centered-cubic materials. The preceding microstructure gradients
are rationalized based on the accumulated thermomechanical cycles during processing. |
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