三维集成

在封装的舞台上,三维集成技术因为在提高电子系统的性能和微型化方面效果卓著而引起重视。目前三维技术的手段一般采用较长的焊线来连接堆叠芯片和基层。新的三维概念仍处在开发阶段,但它将提供更短的互联,更高的互联密度,更低的成本。对于不同的应用,需要有相应且适宜的3D技术。

3D Integration

In the packaging arena, 3D integration has entered the scene, with the promise to enhance miniaturization and performance of electronic systems. Current 3D approaches make use of relatively long wire bonds to connect the stacked dice to the interposer substrate. New 3D concepts are under de- velopment, offering shorter interconnects, higher interconnect densities, lower cost For each application, a suitable 3D flavor should be made available.