| 加强失效分析,提高产品可靠性 |
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| 引用本文： | 魏艳梅. 加强失效分析,提高产品可靠性[J]. 半导体技术, 2002, 27(5): 67-68. DOI: 10.3969/j.issn.1003-353X.2002.05.021 |
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| 作者姓名： | 魏艳梅 |
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| 作者单位： | 871厂,甘肃,天水,741000 |
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| 摘 要： | 通过对一批七专电路键合点严重腐蚀的失效分析,提出了相应的改进措施,使产品的可靠性得到了保障.
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| 关 键 词： | 可靠性 失效分析 半导体器件 |
| 文章编号： | 1003-353X(2002)05-0067-02 |
| 修稿时间： | 2001-05-10 |
Strengthen failure analysis, improve products reliability |
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| WEI Yan-mei. Strengthen failure analysis, improve products reliability[J]. Semiconductor Technology, 2002, 27(5): 67-68. DOI: 10.3969/j.issn.1003-353X.2002.05.021 |
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| Authors: | WEI Yan-mei |
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| Abstract: | By analyzing the failure of a batch of special circuit bonding point that has beenseriously corroded, the improvement methods to ensure device reliability are put forward. |
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| Keywords: | reliability failure analysis semiconductor device |
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