Hybrid reliability assessment for packaging prototyping

The paper presents a physics-based hybrid approach to assist the assessment of thermally induced packaging reliability. This method is applicable to prototypes at different stages of development. The approach realizes the efficiency and effectiveness through some special capabilities in identifying reliability critical locations and evaluating deformation and failure mechanisms. These capabilities are facilitated by the computer vision techniques for multi-scale measurement, including, the digital speckle correlation and the phase-shifted shadow moiré. The techniques combine to become three-dimensional and capable of locating failure prone sites and obtaining failure related parameters at desired spatial resolution. The novelty comes as the experimental measurement is integrated with numerical and analytical modeling. An apparent merit is that the approach can bypass some uncertain issues that could cause deficiency of an assessment if a pure modeling or testing is employed. Following an introduction to the experimental techniques and procedures, application examples are presented to demonstrate the feasibility and the potential of the approach.