| MEMS微梁粘附“突陷”静力分析 |
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| 引用本文： | 田文超,贾建援.MEMS微梁粘附“突陷”静力分析[J].机械科学与技术(西安),2005,24(1):48-50. |
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| 作者姓名： | 田文超 贾建援 |
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| 作者单位： | 田文超（西安电子科技大学机电工程学院,西安,710071）
贾建援（西安电子科技大学机电工程学院,西安,710071） |
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| 基金项目： | "863"发展计划项目(2002AA862011)和西安电子科技大学青年科研工作站基金项目(0404)资助 |
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| 摘 要： | “突陷”现象严重影响着MEMS微梁性能。根据Hamaker微观连续介质修正理论,建立了MEMS微梁同基座粘附力包含斥力的数学模型;分析了微梁的静力平衡关系,发现引起微梁“突陷”的本质是弹性力同粘附力的不稳定平衡问题;通过增加微梁刚度,提出一种控制微梁“突陷”发生的方法,并给出仿真结果。
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| 关 键 词： | MEMS 粘附“突陷” Hamaker微观连续介质修正理论 |
| 文章编号： | 1003-8728(2005)01-0048-03 |
Static Analysis on" Snap Back" of the MEMS Adhesion |
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| TIAN Wen chao,JIA Jian yuan.Static Analysis on" Snap Back" of the MEMS Adhesion[J].Mechanical Science and Technology,2005,24(1):48-50. |
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| Authors: | TIAN Wen chao JIA Jian yuan |
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| Abstract: | The snap back of a micro cantilever affects the performance of the Micro Electro Mechanical System (MEMS). Based of the Hamaker micro continuum medium revision theory, the adhesion mathematic model between the micro cantilever and the base of the MEMS is set up, which includes the repulsive force. The micro cantilever static relationship between the plastic force and the adhesion is discussed. The reason of the micro cantilever "snap back", which is the instable balance point, is discovered. By improving the rigidity of the micro cantilever, a method for avoiding "snap back" is put forward, which is followed by the simulation result. |
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| Keywords: | MEMS Snap-back Hamaker micro continuous revision principle |
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