| 国外微电子封装用导电胶力学性能研究进展 |
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| 引用本文： | 毛玉平,游敏. 国外微电子封装用导电胶力学性能研究进展[J]. 中国胶粘剂, 2005, 14(3): 41-45 |
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| 作者姓名： | 毛玉平 游敏 |
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| 作者单位： | 三峡大学机械与材料学院,湖北省,宜昌市,443002 |
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| 摘 要： | 首先概述了导电胶较之于传统的Sn-Pb焊的优点、应用前景和存在的不足。然后系统地介绍了近来国外关于导电胶力学性能研究的方法和取得的成果。
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| 关 键 词： | 导电胶 力学性能 环境老化 冲击 |
| 文章编号： | 1004-2849(2005)03-0041-05 |
| 修稿时间： | 2004-03-15 |
Oversea progress in mechanical properties of electrically conductive adhesives for microelectronic packages |
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| MAO Yu-ping,YOU Min. Oversea progress in mechanical properties of electrically conductive adhesives for microelectronic packages[J]. China Adhesives, 2005, 14(3): 41-45 |
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| Authors: | MAO Yu-ping YOU Min |
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| Abstract: | The advantage and disadvantage of electrically conductive adhesives and its promise application in the future are briefly introduced,then give the presentation of the methods and results in the research on mechanical properties of electrically conductive adhesives oversea. |
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| Keywords: | electrically conductive adhesives mechanical property environmental aging impact |
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