300 mm Conversion challenge and breakthrough for future semiconductor manufacturing

The status regarding the planned conversion of the semiconductor industry to the larger and more productive 300 mm wafer size is reviewed. Many efforts are already underway to aid the conversion to 300 mm wafers. In addition to the consortiums in both U.S. and Japan, targeted at working with the equipment manufacturers and standard setting, SEMICONDUCTOR300, a joint venture between Motorola and Siemens, will develop a fully integrated process (64M/256M) on a complete toolset. Goal of the SC300 operation is to realize and demonstrate concepts to reduce the cost/die on 300 mm in comparison to 200 mm of approx. 30–40%. A financial model for semiconductor manufacturing using the larger substrates is offered along with the productivity opportunities for each of the equipment types. The authors define equipment manufacturers in terms of performance and financial targets. Achieving these targets is critical to making the conversion happen as well as determining the timing. Finally, the authors offer the breakthrough technologies expected to occur at the 300 mm production level. The noticeable difference between the 300 mm generation of wafer processing in comparison to previous 150 mm and 200 mm conversions is the increase in automation requirements. The 300 mm wafer size will change the way semiconductor factories operate. This presentation offers thoughts of what changes will be required to facilitate 300 mm wafers and beyond.