| 低介电常数聚酰亚胺的研究进展 |
| |
| 引用本文： | 李艳青,唐旭东,董杰.低介电常数聚酰亚胺的研究进展[J].合成技术及应用,2010,25(2):29-32. |
| |
| 作者姓名： | 李艳青 唐旭东 董杰 |
| |
| 作者单位： | 天津科技大学材料科学与化学工程学院,天津,300457 |
| |
| 摘 要： | 现代微电子工业要求层间绝缘材料具有较低的介电常数。该文介绍了几种降低聚酰亚胺介电常数的方法,包括含氟聚酰亚胺、聚酰亚胺无机杂化复合材料和聚酰亚胺多孔材料,其中最为有效的措施是将含氟取代基引入到聚酰亚胺分子结构中。
|
| 关 键 词： | 低介电常数 聚酰亚胺 含氟 无机杂化 多孔材料 |
Research progress of polyimides with low dielectric constant |
| |
| Li Yanqing,Tang Xudong,Dong Jie.Research progress of polyimides with low dielectric constant[J].Synthetic Technology and Application,2010,25(2):29-32. |
| |
| Authors: | Li Yanqing Tang Xudong Dong Jie |
| |
| Affiliation: | (College of Material Science ＆ Chemical Engineering,Tianjin University of Science ＆ Technology,Tianjin 300457,China) |
| |
| Abstract: | Requirements to the interlayer insulating material that has a low dielectric constant are brought forward in modern microelectronics industry.Some methods to reduce the dielectric constant of polyimides were introduced in this paper,including fluorinated polyimides,polyimides inorganic hybrid composite and polyimides porous materials;the most effective measure among them is introducing the fluorine-containing substituents into the molecular structure of polyimides. |
| |
| Keywords: | low dielectric constant polyimides fluorine-containing inorganic hybrid porous materials |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
