| 聚酰亚胺PI／SiC纳米复合材料的制备及特性 |
| |
| 引用本文： | 王铎. 聚酰亚胺PI／SiC纳米复合材料的制备及特性[J]. 合成技术及应用, 2006, 21(3): 45-48 |
| |
| 作者姓名： | 王铎 |
| |
| 作者单位： | 陕西理工学院化学系,陕西,汉中,723001;西安理工大学材料科学与工程,学院,陕西,西安,710061 |
| |
| 摘 要： | 通过熔胶-凝胶方法合成了用于电子封装的聚酰亚胺PI/SiC复合薄膜介电材料,并通过扫描电镜、透射电镜、红外光谱对复合薄膜进行结构表征。结果表明,聚酰亚胺PI／SiC复合材料是一种共聚物,是纳米SiC粒子均匀分散在PI基体中的复合材料体系。在4284A型阻抗分析仪上测量了材料的电容,并换算出相应介电常数,最低达ε=2．0。
|
| 关 键 词： | 聚酰亚胺 薄膜 电子封装材料 介电性能 |
| 文章编号： | 1006-334X（2006）03-0045-04 |
| 收稿时间： | 2006-06-05 |
| 修稿时间： | 2006-06-05 |
Preparation and properties of polyimide/silicon carbide nano composites |
| |
| Wang Duo. Preparation and properties of polyimide/silicon carbide nano composites[J]. Synthetic Technology and Application, 2006, 21(3): 45-48 |
| |
| Authors: | Wang Duo |
| |
| Affiliation: | 1. Department of Chemistry, Shanxi University of Technology, Hanzhong Shanxi 723001, China ; 2. Department of Chemistry, Xian University of Technology, Xian Shanxi 71006, China |
| |
| Abstract: | In this paper, the polyimide/silicon carbide (PI/SiC) nanocomposites for electronic assembly were synthesized using Sol-Gel method and characterized using scanning electron microscope (SEM), Transmission electron microscope (TEM) , Fourier transform infrared spectroscopy (FTIR). It was found that SiC nanoparticles formed chemical bonding with PI functional groups and well dispersed into PI matrix. The as-formed nanocomposites can greatly reduce the dielectric constant to 2.0. |
| |
| Keywords: | polyimide/SiC composite film Sol-Gel dielectric properties |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
