| SiC陶瓷与TiAI合金的真空钎焊 |
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| 引用本文： | 刘会杰,李卓然,冯吉才,钱乙余,陶秋燕,赵正伟. SiC陶瓷与TiAI合金的真空钎焊[J]. 焊接, 1999, 0(3) |
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| 作者姓名： | 刘会杰 李卓然 冯吉才 钱乙余 陶秋燕 赵正伟 |
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| 作者单位： | 哈尔滨工业大学 150001(刘会杰，李卓然，冯吉才，钱乙余)，北京联合大学机械工程学院 100020(陶秋燕)，大庆石油化工设计院 160000(赵正伟) |
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| 基金项目： | 国防科技预研基金，哈工大校管基金，焊接国家重点实验室开放课题资助项目 |
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| 摘 要： | 采用Ag-Cu-Ti钎料对常压烧结的SiC陶瓷与TiAl金属间化合物进行了真空钎焊,并对接头的微观组织和室温强度进行了研究。结果表明,利用Ag-Cu-Ti钎料可以实现SiC与TiAl的连接;接头界面具有明显的层状结构,即由Ti-Cu-Si合金层、富Cu相与富Ag相的双相层和Ti-Al-Cu合金层组成;在1173K和10min的钎焊条件下,接头室温剪切强度达到173MPa。
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| 关 键 词： | SiC陶瓷 TiAl合金 Ag-Cu-Ti钎料 真空钎焊 微观组织 |
VACUUM BRAZING OF SiC CERAMIC TO TiAl ALLOY |
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| Liu Huijie et al.. VACUUM BRAZING OF SiC CERAMIC TO TiAl ALLOY[J]. Welding & Joining, 1999, 0(3) |
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| Authors: | Liu Huijie et al. |
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| Affiliation: | Liu Huijie et al. |
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| Abstract: | The vacuum brazing of pressureless - sintered SiC ceramic to TLAl intermetallic compound was carried out by Ag - Cu-Ti brazing filler metal. The microstructures and strength of the joints were investigated. The experimental results showed that the bonding of SiC to TLAl can be accomplished by Ag - Cu - Ti brazing filler metal. Between SiC and TiAl an interfacial structure occurs, that is clearly composed of Ti - Cu - Si alloy layer, Cu - rich and Ag - rich alloy layer and Ti - Al - Cu alloy layer. The shear strength of the joint, which was brazed at 1173 K for 10 min, is up to 173 MPa at room temperature. |
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| Keywords: | SiC ceramic TiAl alloy Ag- Cu- Ti brazing filler metal vacuum brazing microstructure |
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